Intel has recently outpaced competitors Samsung and SK Hynix by securing the first batch of High-NA EUV lithography equipment from ASML, a key player in semiconductor manufacturing technology. This equipment is crucial for producing smaller, more efficient chips and is expected to play a significant role in Intel’s upcoming 18A and 14A nodes.
Sources indicate that ASML will manufacture only five units of these advanced tools this year, all of which will be supplied to Intel. Meanwhile, Samsung and SK Hynix might not get their hands on the equipment until the latter half of 2025.
The High-NA EUV equipment, costing over 5 trillion Korean won (about US$ 370 million) per unit, represents a substantial investment by Intel, totaling around US$ 2 billion. This new technology can print features up to 1.7 times smaller than current tools, allowing for significant improvements in chip density and manufacturing efficiency.
Intel confirmed in mid-April that it had received and assembled the industry’s first High-NA EUV system. This tool is not just a step up from existing technology but a leap forward, enhancing the ability to scale down chip features significantly, which in turn increases the output per wafer.
Looking ahead, Intel plans to integrate both High-NA EUV and the existing 0.33NA EUV technologies in its chip manufacturing process. The company is set to showcase product demonstrations on the Intel 18A node in 2025, moving towards full production of the Intel 14A thereafter.
In contrast, TSMC, another semiconductor giant, announced that its next technology milestone, the A16 node, would not require High-NA EUV systems. Scheduled for production in 2026, the A16 will incorporate TSMC’s new Super Power Rail architecture with nanosheet transistors.
