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Tech News > Blog > Latest Tech > Gadgets & Product Reviews > Consumer electronics > China Advances in High Bandwidth Memory (HBM) Development, Targets HBM2 by 2026
Consumer electronicsGadgets & Product ReviewsLatest Tech

China Advances in High Bandwidth Memory (HBM) Development, Targets HBM2 by 2026

Elina Norberg
Last updated: May 16, 2024 4:59 am
Elina Norberg 1 year ago
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China is making significant strides in developing High Bandwidth Memory (HBM) semiconductors, aiming to produce HBM2 chips by 2026. Despite facing export restrictions from the United States, Chinese companies are progressing on older versions of HBM to reduce their dependence on international suppliers.

Contents
Key Players in China’s HBM DevelopmentOvercoming ChallengesHuawei’s RoleFocus on HBM2Technical HurdlesConclusion

Key Players in China’s HBM Development

Two major Chinese chip manufacturers, ChangXin Memory Technologies (CXMT) and Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. (XMC), are at the forefront of this effort. CXMT is working with Tongfu Microelectronics to develop HBM chip samples, which they are currently showcasing to potential customers. XMC is building a 12-inch plant with a monthly capacity of 3,000 wafers, expected to start operations soon.

Overcoming Challenges

Both CXMT and XMC are privately funded by local governments to boost technological advancement. They regularly meet with semiconductor equipment manufacturers from South Korea and Japan to acquire the necessary tools for HBM development.

Huawei’s Role

Huawei, despite being under US sanctions, is reportedly collaborating with local companies to produce HBM2 chips by 2026. A group led by Huawei, including Fujian Jinhua Integrated Circuit, is spearheading this effort.

Focus on HBM2

China’s current focus is on HBM2, a type of high-performance memory used mainly in AI chipsets. While the US has not restricted HBM2 exports, the production of HBM3 chips involves US technology, which many Chinese companies are barred from using.

Technical Hurdles

Developing HBM involves complex processes such as wafer-level packaging and testing. Technologies like Through-Silicon Via (TSV), bumps, microbumps, and Redistribution Layer (RDL) are crucial. TSV, in particular, is a significant cost factor, accounting for nearly 30% of the 3D packaging cost of HBM.

Conclusion

China’s push to develop its own HBM technology reflects its broader goal to advance its semiconductor industry and become more self-sufficient in high-tech components. As they move forward, the world will be watching to see how these efforts unfold and impact the global tech landscape.

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